Method and apparatus for optimizing the cutting of raw boards in

Woodworking – Process – Embossing or imprinting

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

29407, 83 44, 83 61, 83 71, 831021, 83408, 83722, 144376, B27B 100, B27B 2700, B27M 100

Patent

active

047949635

ABSTRACT:
An apparatus for optimizing the yield from a raw board, having defects randomly located therein, and for cutting the raw board optimally into product boards of predetermined specification, thereby cutting out any defects. The apparatus includes an adjustable fence located at a defect detection station, oriented along a path and movable transversely to the path. Located at the station are laser lines for temporarily forming lines lengthwise on the raw board. These laser lines cooperate with the fence to determine clear and full widths of the raw board. Also disclosed is a method for using the apparatus for optimizing the yield of the raw board. The clear width and full width information is transmitted to a computer while any waste portion is cut off and as all defects between the laser lines are being marked by an operator. In the meantime, the computer calculates an optimum solution for product to be cut from the board. A sub-board is then cut from the raw board lengthwise, according to the solution calculated by the computer. This leaves a remainder board which is returned to the station while the sub-board is cross-cut into one or a number of product boards as specified in the manifest held in the memory of the computer. Upon its return to the station, the remainder board is again examined and the cycle repeated until the full width has been completely optimized.

REFERENCES:
patent: 2303480 (1942-12-01), Lipic, Jr.
patent: 3329181 (1967-07-01), Buss et al.
patent: 3811353 (1974-05-01), Miles
patent: 3931501 (1976-01-01), Barr et al.
patent: 3941019 (1976-03-01), Baldwin et al.
patent: 4468992 (1984-09-01), McGeehee

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and apparatus for optimizing the cutting of raw boards in does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for optimizing the cutting of raw boards in, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for optimizing the cutting of raw boards in will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2163170

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.