Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2005-09-27
2005-09-27
Nguyen, Tuan H. (Department: 2813)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S108000, C438S116000, C438S401000
Reexamination Certificate
active
06949406
ABSTRACT:
One embodiment of the present invention provides a system that facilitates aligning a first semiconductor die with a second semiconductor die, wherein the first semiconductor die and the second semiconductor die are arranged active face to active face. Note that the active face contains circuitry for communicating between semiconductor dies. The system starts by generating light on an active face of the first semiconductor die. The system then collimates the light within the active face of the first semiconductor die to form a first beam of light which is projected onto the second semiconductor die. Next, the system receives the first beam of light on an active face of the second semiconductor die and determines a position of the first beam of light on the active face of the second semiconductor die. Finally, the system determines an alignment of the second semiconductor die relative to the first semiconductor die based on the determined position of the first beam of light.
REFERENCES:
patent: 6272271 (2001-08-01), Wojnarowski et al.
patent: 6754407 (2004-06-01), Chakravorty et al.
patent: 2002/0105699 (2002-08-01), Miracky et al.
patent: 2002/0145185 (2002-10-01), Shrauger
patent: 2002/0159719 (2002-10-01), Ide et al.
patent: 2003/0030869 (2003-02-01), Kline et al.
patent: 2004/0197046 (2004-10-01), Drost et al.
patent: 1 207 599 (2001-09-01), None
Knight T.F Jr. et al: “Manufacturability of Capacitvely Coupled Multichip Modules” Proceedings of the Electronic Components and Technology Conference. Wahsington, May 1-4, 1994, New York, IEEE, US vol. CONF 44, May 1, 1994, ISBN 0-7803-0914-6.
Bosnyak Robert J.
Drost Robert J.
Nguyen Tuan H.
Park Vaughan & Fleming LLP
Sun Microsystems Inc.
LandOfFree
Method and apparatus for optically aligning integrated... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for optically aligning integrated..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for optically aligning integrated... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3446703