Method and apparatus for notching a lead wire attached to an IC

Details Method and apparatus for notching a lead wire attached to an IC Method and apparatus for notching a lead wire attached to an IC

1990-11-02

1991-11-26

Rosenbaum, Mark

Cutting

Other than completely through work thickness or through work...

Scoring

83693, 83880, 83588, 30245, 295663, B26D 314

Patent

active

050673823

ABSTRACT:
A method and apparatus for notching a wire so that it can be severed at the notched location by applying an axial force thereto. The apparatus includes a linearly reciprocal mechanism adapted to move forwardly, placing a pair of cutting blades in straddling relationship with the wire and includes an actuating mechanism for laterally reciprocating the cutting blades to form notches in opposite sides of the wire before retracting the cutting blades from the straddling relationship with the wire. The method of the invention includes the steps of moving a pair of cutting blades into straddling relationship with a wire, reciprocally moving the cutting blades into and out of cutting engagement with the wire and subsequently retracting the cutting blades from the straddling relationship with the wire.

REFERENCES:
patent: 4425947 (1984-01-01), Maxner et al.

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