Method and apparatus for non-invasively testing integrated...

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

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C324S765010

Reexamination Certificate

active

07057409

ABSTRACT:
The preferred embodiments of the present invention provide non-invasive approaches of testing ICs that use photon emission from semiconductor devices to provide results of various testing procedures. For example, instead of reading the results from the built-in-self-test (BIST) circuitry using micro-mechanical probes, the results from BIST may be represented using an array of circuit elements configured to emit photons. Accordingly, by reading the photon emission of this BIST circuitry, the results of the testing procedures may be measured non-invasively. In addition, the preferred embodiments also may use an external light source to initiate on-chip testing functions so that the number of external connections to the IC may be further minimized. For example, instead of providing input signals to BIST circuitry using micro-mechanical probes, pulsed lasers may provide desired input signals.

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patent: 6815973 (2004-11-01), Conn
Boit, Christian, “Photoemission Microscopy-Advanced/Theory of Operation,” Infineon Semiconductors, pp. 213-223.

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