Method and apparatus for non-destructive target cleanliness...

Data processing: measuring – calibrating – or testing – Measurement system in a specific environment – Mechanical measurement system

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Reexamination Certificate

active

06895342

ABSTRACT:
A preferred, non-destructive method for characterizing sputter target cleanliness includes the steps of sequentially irradiating the test sample with sonic energy predominantly of target sputter track areas; detecting echoes induced by the sonic energy; and discriminating texture-related backscattering noise from the echoes to obtain modified amplitude signals. These modified amplitude signals are compared with one or more calibration values so as to detect flaw data points at certain positions or locations where the comparison indicates the presence of at least one flaw. Most preferably, groups of the flaw data pixels corresponding to single large flaws are bound together so as to generate an adjusted set of flaw data points in which each group is replaced with a single, most significant data point. The adjusted set of flaw data point is used to calculate one or more cleanliness factors, or to plot a histogram, which characterizes the cleanliness of the sample.

REFERENCES:
patent: 2790216 (1957-04-01), Hunter
patent: 4054173 (1977-10-01), Hickam
patent: 4568007 (1986-02-01), Fishler
patent: 5160388 (1992-11-01), Legresy et al.
patent: 5369063 (1994-11-01), Gee et al.
patent: 5406850 (1995-04-01), Bouchard et al.
patent: 5559614 (1996-09-01), Urbish et al.
patent: 5636681 (1997-06-01), Sulzer et al.
patent: 5738767 (1998-04-01), Coad et al.
patent: 5827409 (1998-10-01), Iwata et al.
patent: 5887481 (1999-03-01), Leroy et al.
patent: 5943559 (1999-08-01), Maeda
patent: 5955673 (1999-09-01), Leroy et al.
patent: 5989782 (1999-11-01), Nishiki et al.
patent: 6001227 (1999-12-01), Pavate et al.
patent: 6017779 (2000-01-01), Miyasaka
patent: 6019657 (2000-02-01), Chakvorty et al.
patent: 6020946 (2000-02-01), Callegari et al.
patent: 6057557 (2000-05-01), Ichikawa
patent: 6139701 (2000-10-01), Pavate et al.
patent: 6269699 (2001-08-01), Gilman et al.
patent: 6487910 (2002-12-01), Leybovich
patent: 0 211 401 (1992-05-01), None
patent: 0 418 846 (1995-02-01), None
patent: 0 665 193 (1995-08-01), None
patent: 0 467 659 (1996-03-01), None
patent: 0 412 843 (1996-05-01), None
patent: 0 561 161 (1997-04-01), None
patent: WO 9730348 (1997-08-01), None
patent: WO 9964854 (1999-12-01), None
patent: WO 0015863 (2000-03-01), None
patent: WO 0186282 (2001-11-01), None
patent: WO 02081767 (2002-10-01), None
Freitag, W.O. et al., “Diode Sputtering of Cermet Films,”2nd Symposium on Deposition of Thin Films by Sputtering, University of Rochester and Consolidated Vacuum Corporation, Rochester, NY, Jun. 1967, pp. 92-96.
Robinson, J.E. et al., “Models for Chunk Sputtering,”Journal of Nuclear Materials, 1976, vol. 63, pp. 432-437, North-Holland Publishing Company.
Eernisse, E.P. et al., “Role of Integrated Lateral Stress in Surface Deformation of He-Implanted Surfaces,”Journal of Applied Physics, Jan. 1, 1977, vol. 48, No. 1, pp. 9-17, American Institute of Physics.
Roth, R.M. et al., “Spatial Dependence of Particle Light Scattering in an RF Silane Discharge,”Appl. Phys. Letter, Feb. 1, 1985, vol. 46, No. 3, pp. 253-255, American Institute of Physics.
Spears, K.G. et al., “Particle Distributions and Laser-Particle Interactions in an RF Discharge of Silane,”IEEE Transactions on Plasma Science, Apr. 1986, vol. PS-14, No. 2, pp. 179-187, IEEE.
Anderson, H.M. et al., “Particulate Generation in Silane / Ammonia RF Discharges,”J. Applied Physics, May 1, 1990, vol. 67, No. 9, pp. 3999-4011, American Institute of Physics.
Jellum, G.M. et al, “Particulates in Aluminum Sputtering Discharges,”J. Appl. Phys., May 15, 1990, vol. 67 No. 10, pp. 6490-6496, American Institute of Physics.
Selwyn, G.S. et al., “Particle Trapping Phenomena in Radio Frequency Plasmas,”Appl. Phys. Letter, Oct. 29, 1990, vol. 57, No. 18 pp. 1876-1878, American Institute of Physics.
Akari, K. et al., “Reduction in Macroparticles During the Deposition of TiN Films Prepared by Arc Ion Plating,”Surface and Coatings Technology, 1990, 43/44, pp. 312-323, Elsevier Sequoia, The Netherlands.
Barnes, M.S. et al., “Transport of Dust Particles in Glow-Discharge Plasmas,”Physical Review Letters, Jan. 20, 1992, vol. 68, No. 3, pp. 313-316, The American Physical Society.
Smadi, M.M. et al., “Particle Contamination on a Silicon Substrate in a SF6/ Ar Plasma,”J. Vac. Sci. Techol., Jan./Feb. 1992, B 10, (1) pp. 30-36, American Vacuum Society.
Logan, J.S. et al., “Study of Particle Emission in Vacuum from Film Deposits,”J. Vac. Sci. Technol., Jul./Aug. 1992, A 10, (4) pp. 1875-1878, American Vacuum Society.
Goree J. et al., “Particulate Release from Surfaces Exposed to a Plasma,”J. Vac. Sci. Techol., Nov./Dec. 1992, A 10, (6) pp. 3540-3544, American Vacuum Society.
Foster, H.I. et al., “A Modular Approach to Sputter Coating of Flat Panel Displays,”Society of Vacuum Coaters 35thAnnual Technical Conference, 1992, pp. 357-361.
Anderson, L., “A New Technique for Arc Control in DC Sputtering,”Society of Vacuum Coaters 35thAnnual Technical Conference Proceedings, 1992, pp. 325-329.
Nadel, S.J. et al., “Enhanced Chromium First Surface Mirrors,”Society of Vacuum Coaters, 35th Annual Technical Conference Proceedings, 1992, pp. 365-369.
Scholl, R.A., “A New Method of Handling Arcs and Reducing Particulates in DC Plasma Processing,”Society of Vacuum Coaters 37th Annual Technical Conference Proceedings, 1994, pp. 312-315, Advanced Energy Industries, Inc.
Lee, F. et al., “Detecting and Reducing Particles for LPCVD Silicon Nitride Deposition,”Microcontamination, Mar. 1994, vol. 12, pp. 33-37, 76-77.
Bailey, R.S. et al., “Particle Emission from Al2O3Doped Aluminum Targets During Sputtering Deposition,”VMIC Conference, ISMIC, Jun. 7-8, 1994, p. 317.
Danovitch, D. et al., “Sputtering Issues for Flat-Panel Displays,”Information Display, Nov. 1995, pp. 26-27, 30-31.
Selwyn, G.S. et al., “Particle Contamination Formation in Magneton Sputtering Processes,”J. Vac. Sci. Technol, Jul./Aug. 1997, A 15 (4), pp. 2023-2028, American Vacuum Society.
Abburi, M. et al., “Low-Defect Target Metallurgy Development for sub-0.18 μm Al-based Interconnects,”Solid State Technology, Dec. 1999, vol. 42, pp. 55-58, Solid State Technology.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and apparatus for non-destructive target cleanliness... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for non-destructive target cleanliness..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for non-destructive target cleanliness... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3456685

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.