Method and apparatus for non-contact pulsating jet cleaving of a

Details Method and apparatus for non-contact pulsating jet cleaving of a Method and apparatus for non-contact pulsating jet cleaving of a

1998-12-10

2000-08-15

Rachuba, M.

Severing by tearing or breaking

Methods

225 93, 438 68, 438460, 438458, 438464, H01L 21301, H01L 2146, H01L 2178, H01L 2100

Patent

active

061022675

ABSTRACT:
An apparatus and a method for non-contact cleaving a brittle, non-metallic solid material, such as semiconductor material, glass, quartz, ceramic or like material. A pulsating gas jet directs a jet of gas toward a support structure formed of a non-compliant material. The semiconductor material is positioned on the support structure between a pair of film layers. The semiconductor material is scored in at least one location on the material. A plastic buffer material is adhered to the support structure. The semiconductor material and the film layers are moved along the support structure until the score line is at a ledge of the support structure and underneath the source of gas. The jet of gas applies a sufficient force to cleave the semiconductor material as it passes off the ledge of the support structure, while minimizing vibration and/or turbulence. The buffer provides cushioning and inhibits the formation of fractures during the cleaving process.

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