Method and apparatus for non-conductively interconnecting...

Details Method and apparatus for non-conductively interconnecting... Method and apparatus for non-conductively interconnecting...

2005-07-12

2005-07-12

Zarabian, Amir (Department: 2822)

Semiconductor device manufacturing: process

Making passive device

C438S107000, C438S129000, C438S171000, C438S190000, C438S210000, C438S329000, C438S239000, C361S760000, C257S664000

Reexamination Certificate

active

06916719

ABSTRACT:
Methods and apparatus are described for capacitively signaling between different semiconductor chips and modules without the use of connectors, solder bumps, wire-bond interconnections or the like. Preferably, pairs of half-capacitor plates, one half located on each chip, module or substrate are used to capacitively couple signals from one chip, module or substrate to another. The use of plates relaxes the need for high precision alignment as well as reduces the area needed to effect signaling, and reduces or eliminates the requirements for exotic metallurgy.

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