Method and apparatus for mounting soldering balls onto electrode

Details Method and apparatus for mounting soldering balls onto electrode Method and apparatus for mounting soldering balls onto electrode

1996-02-06

1997-12-09

Walberg, Teresa J.

Electric heating

Heating devices

Combined with container, enclosure, or support for material...

219 8519, 219 8522, 2281801, 228254, 29741, 29743, F27B 906, F27B 938, B23K 306, B23K 3102

Patent

active

056956673

ABSTRACT:
A pickup head 11 has a lower surface with absorbing holes 9 for picking up a plurality of soldering balls 1 from a soldering ball reservoir 15 by suction force of vacuum. Pickup head 11 mounts these soldering balls 1 on electrodes 5 formed on substrate 4 placed on a conveyor 8. Then, soldering balls 1 are transported below a camera 21. Camera 21 monitors the upper surface of substrate 4 to check whether each of electrodes 5 mounts a soldering ball 1. An absorbing head 31 mounts a supplemental soldering ball 1 on a faulty electrode 5 which lacks a soldering ball 1 to be mounted thereon when this faulty electrode 5 is detected by camera 21. After all of electrodes 5 mount soldering balls 1, substrate 4 is sent by conveyor 8 to a furnace 40 where each soldering ball 1 is heated and melted to form soldering bumps 1' on electrodes 5.

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