Method and apparatus for mounting soldering balls onto electrode

Details Method and apparatus for mounting soldering balls onto electrode Method and apparatus for mounting soldering balls onto electrode

1995-08-28

1997-08-12

Ramsey, Kenneth J.

Metal fusion bonding

Process

Preplacing solid filler

228 41, B23K 120

Patent

active

056557043

ABSTRACT:
A soldering ball mounting apparatus comprises a workpiece positioning mechanism "A" for positioning a workpiece 2 at a predetermined position. The workpiece 2 has an upper face formed with a plurality of electrodes 2a on which soldering balls 3 are mounted. A template 4, provided with a plurality of through holes 4a corresponding to the electrodes 2a in a one-to-one relationship, is supportable in such a manner that their through holes 4a are positioned just above the corresponding electrodes 2a of the workpiece 2. A soldering ball container 12 is provided on the template 4 for accommodating soldering balls 3 therein. The soldering ball container 12 has an open bottom allowing the soldering balls 3 to fall below the template 4 via the through holes 4a. A pair of X and Y motors shifts the soldering ball container 12 along the upper surface of the template 4 disposed in a horizontal direction.

REFERENCES:
patent: 5324569 (1994-06-01), Nagesh et al.
patent: 5431332 (1995-07-01), Kirby et al.

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