Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – To produce composite – plural part or multilayered article
Patent
1990-10-01
1992-10-13
Ball, Michael W.
Plastic and nonmetallic article shaping or treating: processes
Mechanical shaping or molding to form or reform shaped article
To produce composite, plural part or multilayered article
2642978, 425123, 425125, 425127, H01L 21304, H01L 2178, B29C 3910
Patent
active
051548739
ABSTRACT:
It is known that it is advantageous in semiconductor wafer production to re-slice a semiconductor wafer having impurity diffusion layers on both sides which are processed or doped in advance of the re-slicing process. In the re-slicing process, a thin slice base is mounted on the periphery of a semiconductor wafer prior to the re-slicing process for protecting the periphery of the wafer from chipping off damage during the re-slicing process by an ID saw or the like. The present invention provides several examples of methods and apparatus for mounting a slice base prepared in advance on the periphery of a semiconductor wafer by utilizing the method and apparatus of the present invention. In addition, another method and apparatus for simultaneously molding and mounting a molded type slice base by using a thermosetting type resin on the periphery of the semiconductor, whereby the re-slicing process of a semiconductor wafer is extremely improved in production and labor cost.
REFERENCES:
patent: 4261781 (1981-04-01), Edmonds et al.
Partial English translation of Japanese Publication No. 1-293613.
Partial English translation of Japanese Publication No. 64-19729.
Sato Tsutomu
Yoshimura Yasushi
Ball Michael W.
Naoetsu Electronics Company
Yoder Michele K.
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