Method and apparatus for mounting slice base on wafer of semicon

Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – To produce composite – plural part or multilayered article

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Details

2642978, 425123, 425125, 425127, H01L 21304, H01L 2178, B29C 3910

Patent

active

051548739

ABSTRACT:
It is known that it is advantageous in semiconductor wafer production to re-slice a semiconductor wafer having impurity diffusion layers on both sides which are processed or doped in advance of the re-slicing process. In the re-slicing process, a thin slice base is mounted on the periphery of a semiconductor wafer prior to the re-slicing process for protecting the periphery of the wafer from chipping off damage during the re-slicing process by an ID saw or the like. The present invention provides several examples of methods and apparatus for mounting a slice base prepared in advance on the periphery of a semiconductor wafer by utilizing the method and apparatus of the present invention. In addition, another method and apparatus for simultaneously molding and mounting a molded type slice base by using a thermosetting type resin on the periphery of the semiconductor, whereby the re-slicing process of a semiconductor wafer is extremely improved in production and labor cost.

REFERENCES:
patent: 4261781 (1981-04-01), Edmonds et al.
Partial English translation of Japanese Publication No. 1-293613.
Partial English translation of Japanese Publication No. 64-19729.

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