Method and apparatus for mounting semiconductor chips

Details Method and apparatus for mounting semiconductor chips Method and apparatus for mounting semiconductor chips

2005-07-01

2008-08-26

Nguyen, Donghai D. (Department: 3729)

Metal working

Means to assemble or disassemble

Means to assemble electrical device

C029S832000, C029S834000, C198S468400

Reexamination Certificate

active

07415759

ABSTRACT:
A method for mounting semiconductor chips onto a substrate with which substrate places are arranged in columns, whereby the semiconductor chips adhering to a foil are presented on a wafer table, whereby the detachment of a semiconductor chip from the foil is supported by means of a die ejector and whereby a pick and place device picks the semiconductor chip presented above the die ejector and deposits it onto the substrate comprises:Forward feeding the substrate along a transport direction designated as x direction,Equipping a predetermined number of columns with semiconductor chips in accordance with the steps:Moving the pick and place device to an x position corresponding to the column to be equipped,Moving the die ejector to this x position, andEquipping the substrate places of the column.

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