Method and apparatus for mounting parts with pick-up mistake det

Metal working – Method of mechanical manufacture – Electrical device making

Patent

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Details

2940101, 2940704, 29714, 29721, 29743, 29759, 29832, 29834, H05K 330, B23P 1100, B23P 2100

Patent

active

059114568

ABSTRACT:
There is disclosed an electronic parts mounting method in which it is possible to avoid a pick-up mistake for electronic parts (chips) in simultaneously picking up the chips respectively stored in juxtaposed parts feeders by a plurality of nozzles provided to a transfer head. Nozzle position data of first, second and third nozzles 9a, 9b and 9c are beforehand obtained by a first camera, and pick-up positions of the chips in parts feeders 4 are obtained by a second camera. After picking up respectively the chips in the parts feeders 4 by the nozzles 9a to 9c it is judged whether or not there would be caused the pick-up mistake. When it is judged there is caused no pick-up mistake, a transfer head is moved to a position above a board and each of the chips is mounted to the board. When it is judged there is caused any pick-up mistake, a pick-up mistake rate of any of the parts feeders in which the pick-up mistake occurs, is updated and each of the chips is picked up again by the nozzle which caused the pick-up mistake.

REFERENCES:
patent: 5491888 (1996-02-01), Sakurai et al.
A Partal English Translation of JP-3-70920.

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