Metal deforming – By or with work-constrainer and/or manipulated work-forcer – Comprising lever manipulated to force work
Patent
1997-03-21
1998-06-02
Jones, David
Metal deforming
By or with work-constrainer and/or manipulated work-forcer
Comprising lever manipulated to force work
72479, 72217, 140106, 29242, B21J 1308, B21D 700
Patent
active
057585377
ABSTRACT:
A method and apparatus for mounting, inspecting, and adjusting probe card needles used during testing of fabricated circuits. A build wafer, comprised of build and scrub target patterns, is used to mount and re-work probe needle assemblies onto a probe card. Each build target is composed of a hard material that is resistant to probe needle scratching, and is offset a preset distance from the position of the bonding pads on the actual wafer to be tested. Each scrub target is composed of a soft material that is easily disturbed by the probe needle's scrubbing action. By counting the number of lines broken or cut by a probe needle's scrub mark, the approximate length and width of the scrub mark may be ascertained. An adjustment tool is designed to fit snugly around the untapered, thickest portion of the probe needle. The tool is rotated along the axis of the probe needle shaft, allowing the technician to "tweak" the probe needle either up or down. In one embodiment, the tool consists of a three parallel cylinders, triangularly spaced, and attached orthogonally to the end of an offset lever. The spacing between the cylinders can accommodate the diameter of the thickest portion of a probe needle.
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Brady III W. James
Donaldson Richard L.
Jones David
Swayze, Jr. W. Daniel
Texas Instruments Incorporated
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