Method and apparatus for mounting electronic component

Details Method and apparatus for mounting electronic component Method and apparatus for mounting electronic component

1996-09-04

1999-02-09

Ryan, Patrick

Metal fusion bonding

Process

Plural joints

228215, 228 41, 118504, 427282, B23K 100, B23K 308, B23K 3102

Patent

active

058683020

ABSTRACT:
In a method and a device for mounting an electronic component, a solder paste is printed on lands of a substrate with the use of a mask having a projecting part at a portion facing the substrate and positioned to between neighboring lands, and the projecting part prevents the solder paste on of the neighboring lands from flowing so as to come in contact with a other of the neighboring land to cause a shortcircuit between the neighboring lands.

REFERENCES:
patent: 4918277 (1990-04-01), Zimmer
patent: 5460316 (1995-10-01), Hefele
"A Metal Mask and Screen Assembly for Printing Thick-Films onto Substrates . . . ," RCA Technical Notes, TN No. 978; Sep. 17, 1974.
J.A. Slattery & C.E.T. White, "A Primer on the use of Solder Creams in Hybrid Assembly," Electronic Packaging and Production, Oct. 1981, pp. 146-156.

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