Method and apparatus for mounting electronic component

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29720, 29743, 348 87, 364559, G06F 1900

Patent

active

058547452

ABSTRACT:
When an electronic component is picked up at an electronic component feeding part and then positioned and mounted at a predetermined mounting position on a transparent panel, mounting position marks formed at the mounting position on the transparent panel are registered with positioning marks formed on the electronic component, to thereby recognize the relative position from a surface opposite to a surface of the transparent panel where the electronic component is to be mounted, so that the position of the electronic component is corrected based on the result of the recognition before the electronic component is mounted at the predetermined mounting position on the transparent panel.

REFERENCES:
patent: Re33974 (1992-06-01), Asai et al.
patent: 5002493 (1991-03-01), Brown et al.
patent: 5212881 (1993-05-01), Nishitsuka et al.
patent: 5420691 (1995-05-01), Kawaguchi

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