Image analysis – Applications – Manufacturing or product inspection
Patent
1998-01-08
2000-03-28
Boudreau, Leo H.
Image analysis
Applications
Manufacturing or product inspection
29740, G06K 900, B23P 1900
Patent
active
060441690
DESCRIPTION:
BRIEF SUMMARY
TECHNICAL FIELD
The present invention relates to a method and an apparatus for mounting electronic components on boards.
BACKGROUND ART
In these days, shortening of a time for mounting electronic components is increasingly required to improve productivity.
Hereinbelow, an example of a conventional electronic component mounting apparatus will be described with reference to the drawings. FIG. 12 schematically illustrates the whole constitution of a conventional mounting apparatus. In FIG. 12, 30 is an electronic component feed section for supplying an electronic component 31, and 32 is a board. 35 is a head section having two, i.e., a first and a second suction nozzles 12, 13 and a recognition camera 15, 33 is an X-axis table for moving the head section 35 in an X-axis direction, and 34 is a Y-axis table for moving the head section 35 in a Y-axis direction orthogonal to the X-axis direction which is a direction of the movement of the head section 35 by the X-axis table 33. The head section 35 is positioned at an optional position by the X-axis and Y-axis tables 33, 34. 100 is a main controller for the mounting apparatus and 104 is an operation panel of the apparatus.
In the conventional mounting apparatus of this type, the electronic component 31 in the component feed section 30 is mounted to the board 32 by the head section 35 in a single mounting procedure. That is, sucking of one component and mounting of one component are alternately carried out repeatedly.
The mounting procedure at the head section 35 is diagrammatically represented in FIGS. 3A-3J. FIG. 5 is a timing chart of the procedure. Portions shown by inclined lines in the timing chart from the "movement of the head section" to the "corrective rotation of the second nozzle" excluding the "recognition" process represents where the head section 35 is being driven, and portions shown by horizontal lines represent where the head section 35 is not driven. In the recognition process, upper straight parts are where the recognition process is executed, lower straight parts are where the recognition process is stopped and fine sawtoothed parts are where the recognition process is kept in a standby mode by a timer. After receiving a movement completion signal of a slide unit 14, a mirror in the slide unit 14 is vibrated consequent to the movement of the slide unit 14. The recognition process is not started until the vibration of the mirror is stopped, and the above standby time is provided for the mirror to stop vibrating. Referring to FIGS. 3A-3J, 12 is the first nozzle in the head section 35 and, 13 is the second nozzle also set in the head section 35 together with the first nozzle 12. 14 is the slide unit having a plurality of reflecting mirrors and set in the head section 35, and the slide unit 14 transmits a light image of the electronic component 31 sucked by the first or second nozzle 12, 13 to the recognition camera 15 of the head section 31 via the reflecting mirrors thereof. In the head section 35, the slide unit 14 moves in a horizontal direction between the first and second nozzles 12 and 13 to the recognition camera 15. The light image of the electronic component sucked by the first nozzle 12 is transmitted to the recognition camera 15 via the slide unit 14 at the side of the first nozzle 12. On the other hand, the light image of the electronic component sucked by the second nozzle 13 is transmitted to the recognition camera 15 via the slide unit 14 at the side of the second nozzle 13.
In the first place, the head section 35 is moved through the movement of the X-axis and Y-axis tables 33, 34 to a suction position 19 of the feed section 30 for suction by the first nozzle 12 (FIG. 3A). When the head section 35 is completely moved to the suction position 19 of the feed section 30, the first nozzle 12 descends, thereby sucking an electronic component 17 located at the suction position 19 (FIG. 3B). At this time, the second nozzle 13 is at a raised position and the slide unit 14 is set at the side of the second nozzle 13, so that the first noz
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Hirotani Koji
Inutsuka Ryoji
Nakano Tomoyuki
Ohe Kunio
Boudreau Leo H.
Cage Shawn B.
Matsushita Electric - Industrial Co., Ltd.
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