Method and apparatus for mounting electronic component

Details Method and apparatus for mounting electronic component Method and apparatus for mounting electronic component

1992-03-19

1993-10-05

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29740, 29741, 29759, H05K 330, B23P 1900

Patent

active

052493563

ABSTRACT:
An electronic component mounting apparatus includes a table for feeding in and out a printed circuit board and holding the board thereon, a supply section for supplying an electronic component, a head portion for suctioning the component thereto and mounting the component on the board, an XY-robot for placing the head portion at an arbitrary position, a suction device for suctioning the component thereto, arranged at the head portion and vertically moving with respect to the head portion, and having a function of placing the component in a rotational direction thereof, a recognizing camera for recognizing the component and measuring an error amount of a position of the component before and after correction of the position of the component, and a controller for controlling the head portion, the XY-robot, and the camera. The error amount of the position of the component is measured after the suction device suctions the component thereto, the position of the component is again measured after the correction of an erroneous position of the component in the rotational direction is accomplished, and the component is mounted on the board after the correction of the erroneous position of the component is accurately accomplished.

REFERENCES:
patent: 4951383 (1990-08-01), Amao et al.
patent: 4979290 (1990-12-01), Chiba
patent: 4980971 (1991-01-01), Bartschat et al.
patent: 5044072 (1991-09-01), Blais et al.
patent: 5084959 (1992-02-01), Ando et al.
patent: 5084962 (1992-02-01), Takahashi et al.
patent: 5086559 (1992-02-01), Akatsuchi
patent: 5115559 (1992-05-01), Oyama

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