Method and apparatus for mounting, cooling, interconnecting, and

Details Method and apparatus for mounting, cooling, interconnecting, and Method and apparatus for mounting, cooling, interconnecting, and

1991-07-08

1993-05-04

Joyce, Harold

Ventilation

Electronic cabinet

361384, 363141, H05K 720

Patent

active

052076130

ABSTRACT:
A high density electronic module packaging system includes a cabinet for housing a plurality of modules. Disposed at the rear of the cabinet and forming a rear wall thereof is a cooling system housing that is used for cooling the modules contained in the cabinet. Disposed within the cabinet are a plurality, e.g., four, cooling modules; a power distribution unit having a plurality, e.g., twelve, power converters; and a plurality, e.g., twenty-eight electronic modules. The number of cooling modules, power converters and electronic modules may be added or subtracted as needed or desired. The cooling modules flow cooling fluid to and/or from the power distribution unit and/or to the plurality of electronic modules. The power distribution unit supplies power to the plurality of electronic modules. The electronic modules may house one or more submodules such as storage devices (e.g., disk drives) or printed circuit boards.

REFERENCES:
patent: 3039377 (1962-06-01), Wernli
patent: 3137212 (1964-06-01), Rose
patent: 3177404 (1965-04-01), Patmore
patent: 3198991 (1965-08-01), Barnett
patent: 3218518 (1965-11-01), Ashbridge
patent: 3280377 (1966-10-01), Harris et al.
patent: 3483433 (1969-12-01), Ettinger et al.
patent: 3566190 (1971-02-01), Huebner
patent: 3818283 (1974-06-01), Ward
patent: 3982584 (1976-09-01), Spanoudis
patent: 4002955 (1977-01-01), Eggert et al.
patent: 4148534 (1979-04-01), Veburg
patent: 4149218 (1979-04-01), Carrubba et al.
patent: 4152750 (1979-05-01), Bremenour et al.
patent: 4215386 (1980-07-01), Prager
patent: 4251853 (1981-02-01), Sites
patent: 4342002 (1982-07-01), Gabr
patent: 4442475 (1984-04-01), Franklin et al.
patent: 4520424 (1985-05-01), Carpenter et al.
patent: 4528614 (1985-07-01), Shariff et al.
patent: 4591949 (1986-05-01), Lahr
patent: 4600326 (1986-07-01), Fudatsuji et al.
patent: 4628413 (1986-12-01), Speraw
patent: 4648007 (1987-03-01), Garner
patent: 4652769 (1987-03-01), Smith et al.
patent: 4674004 (1987-06-01), Smith et al.
patent: 4738632 (1988-04-01), Schmidt et al.
patent: 4744005 (1988-05-01), Milani
patent: 4748540 (1988-05-01), Henneberg et al.
patent: 4758925 (1988-07-01), Obata et al.
patent: 5101320 (1992-03-01), Bhargava et al.

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