Metal working – Barrier layer or semiconductor device making
Reexamination Certificate
1999-03-12
2001-07-24
Graybill, David E (Department: 2814)
Metal working
Barrier layer or semiconductor device making
Reexamination Certificate
active
06264704
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a method for supplying a divided component which is separated previously into individual parts and is stored in a storage body and bringing a divided component after being processed back into the storage body, and an apparatus for executing the method. The divided component is, e.g., individual semiconductor substrate cut from a semiconductor wafer.
2. Description of the Related Art
A circuit board with a plurality of the same circuit sections
24
formed therein, that is, a bulk circuit board
23
is sent to an electronic component mounting apparatus to secure high productivity, as shown in FIG.
18
. Every one or every plurality of electronic components
21
held by an electronic component mounting nozzle
20
are mounted to the circuit sections
24
of the circuit board
23
by the nozzle
20
. A circuit board with the electronic components mounted is carried out when the electronic components
21
are mounted to all circuit sections
24
of the circuit board
23
. The component mounted circuit board is separated into individual circuit parts
26
with the electronic components and then the separated circuit parts
26
are supplied to a next process.
In the case where the electronic components
21
are mounted to the circuit sections
24
by flip-chip mounting, more specifically, electrodes
28
on each circuit section
24
are connected to electrodes
25
of the corresponding electronic component
21
via bumps
22
as shown in
FIG. 19
, and then the circuit board
23
is separated into individual circuit parts
26
by a cracking along scribe lines. In this case, since the circuit sections
24
are warped, a stress acts on each connected part between the electrodes
28
on the circuit section
24
and the electrodes
25
on the electronic component
21
. Thus the connected part may be disconnected by the stress, that is, the stress may cause a junction failure. For solving the problem, the circuit board
23
is separated beforehand into the individual circuit sections
24
and the divided circuit sections
24
are supplied to the electronic component mounting apparatus for mounting of the electronic components
21
thereto, and then individual circuit parts
26
mounting the electric components
21
thereon are transferred to the next process as mentioned above.
However, an effective means for supplying each divided circuit section
24
to the electronic component mounting apparatus and transferring the finished circuit parts
26
to the next process has not yet been devised.
SUMMARY OF THE INVENTION
The present invention accordingly provides a method for mounting components and an apparatus for executing the method whereby each divided component can be supplied in a manner that will not give rise to a junction failure at a junction part where the divided component and a component mounted on the divided component are connected. Also, a divided component with the component mounted on the divided component can be transferred, so that the divided component with the component mounted thereto is improved in quality.
According to a first aspect of the present invention, there is provided a method for mounting component which comprises:
taking out a divided component separated from a collective part from a storage body;
mounting a component to the taken divided component; and
storing a divided component with the component mounted thereto into the storage body again.
According to a second aspect of the present invention, there is provided an apparatus for mounting component, which comprises:
a storage body for storing a divided component separated from a collective part;
a take-out and storage unit which takes out the divided component from the storage body, brings back the divided component with component mounted thereto into the storage body, further transfers the divided component from the storage body to a component mount stage where the component is mounted to the divided component and transfers the divided component with the component mounted thereto from the component mount stage to the storage body;
a mounting unit which mounts the component to the divided component taken out by the take-out and storage unit thereby forming the divided component with the component mounted thereto; and
a control unit which controls operations of the take-out and storage unit and the mounting unit.
According to the component mount method in the first aspect of the present invention and the component mounting apparatus in the second aspect of the present invention, there are provided the take-out and storage unit and the mounting unit, whereby the component is mounted to the divided component taken out from the storage body and then the divided component with the component mounted thereto is collected into the storage body again. Accordingly, regarding any component such that a problem is occurred when a collective part mounting components thereto is separated to a respective divided component with the component mounted thereto as the conventional art, in the present invention, the divided component separated previously from the collective part can be supplied by the storage body storing the divided component, and the component can be mounted to the individual divided component. Therefore, each divided component with the component mounted thereto is improved in quality without the inconvenience experienced in the prior art. Moreover, the divided components with the components can be collected again into the storage body, so that each divided component can be handled with ease.
REFERENCES:
patent: 4731923 (1988-03-01), Yagi et al.
patent: 5628111 (1997-05-01), Iwasaki et al.
patent: 5667129 (1997-09-01), Morita et al.
patent: 5839187 (1998-11-01), Sato et al.
patent: 5894657 (1999-04-01), Kanayama et al.
Higashi Kazushi
Hosotani Naoto
Kanayama Shinji
Minamitani Shozo
Shida Satoshi
Graybill David E
Matsushita Electric - Industrial Co., Ltd.
Wenderoth , Lind & Ponack, L.L.P.
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