Method and apparatus for mounting an integrated circuit to a pri

Details Method and apparatus for mounting an integrated circuit to a pri Method and apparatus for mounting an integrated circuit to a pri

1996-05-06

1999-11-16

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

257718, 257719, H01L 2144

Patent

active

059856971

ABSTRACT:
An apparatus for mounting an integrated circuit chip to a main printed circuit board is disclosed. The mounting apparatus is particularly suitable for situations in which a cooling device of significant mass is used to cool the integrated circuit chip. In one embodiment, the mounting apparatus mounts the integrated circuit chip onto a daughter or sub-printed circuit (PC) board, attaches the cooling device to the integrated circuit chip, supports the cooling device (as well as the integrated circuit chip and the daughter or sub-PC board) with support members, and uses flexible conductors to electrically connect the daughter or sub-PC board to the main printed circuit board. In another embodiment, the mounting apparatus attaches the cooling device to the integrated circuit chip, supports the cooling device (as well as the integrated circuit chip) with support members, and uses a flexible connection means to electrically connect the integrated circuit chip to the printed circuit board. In either case, inertial loads, particularly those associated with the mass of the cooling device, induced by impulse forces or vibrations are shielded from damaging the connections between the integrated circuit chip and the associated printed circuit board. A method for mounting an integrated circuit is also disclosed.

REFERENCES:
patent: 4415025 (1983-11-01), Horvath
patent: 4514752 (1985-04-01), Engel et al.
patent: 5459352 (1995-10-01), Layton et al.
patent: 5786635 (1998-07-01), Alcoe et al.
patent: 5838064 (1998-11-01), Shimada et al.

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