Method and apparatus for mounting a component to a substrate usi

Details Method and apparatus for mounting a component to a substrate usi Method and apparatus for mounting a component to a substrate usi

1995-03-27

1997-02-25

Graybill, David E.

Metal working

Barrier layer or semiconductor device making

437183, 437216, H01L 21288, H01L 2158, H01L 21603

Patent

active

056055471

ABSTRACT:
A method and apparatus for mounting a component, such as a semiconductor die, to a substrate are provided. A z-axis anisotropic adhesive is applied to the substrate and the component is placed on the anisotropic adhesive. During a curing process a cover film is drawn over the component and substrate to maintain the anisotropic adhesive in compression. A conveyorized curing apparatus includes a conveyor belt for moving the substrate through a heated process chamber. The cover film is mounted on an endless belt and is adapted to move at a same speed as the conveyor belt. As the die and substrate are moved through the process chamber, a vacuum plenum draws the cover film over the die and substrate to exert a uniform force on the component.

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"Poly-Flex Circuits News Release", Issue 823, Nov. 14, 1994, author unknown .

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