Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
1999-01-15
2001-06-19
Donels, Jeffrey (Department: 2937)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S688000, C361S697000
Reexamination Certificate
active
06249428
ABSTRACT:
BACKGROUND
This disclosure relates generally to personal computers (“PCs”), and more particularly to a method and apparatus for mounting relatively heavy components in a PC.
PCs contain many components that generate heat and, in some instances, heat sinks are attached to the components to dissipate heat. However, heat sinks are relatively heavy, and must be supported to withstand shock and vibrations. Further, the component itself is often relatively heavy, for example, as with the Intel Xeon processor.
In view of the heaviness, the conventional method of mounting such a component and heat sink includes using massive plastic parts to secure the component, and requires the motherboard to become a structural support. Conventional methods are undesirable for several reasons. First, the plastic parts impede airflow over the heat sink, making it less effective. Second, requiring the motherboard to support the component wastes space and places stress on the motherboard, creating manufacturing and assembly problems. Third, many components must be mounted precisely, which can be difficult without a guide.
Therefore, what is needed is a mounting system for a component and a heat sink that minimalizes airflow restrictions, helps seat the component correctly, and reduces the number of components using the motherboard for support. Decreasing the number of components using the motherboard for support reduces stress on the motherboard and makes board design easier, resulting in smaller, more cost effective motherboards.
SUMMARY
Accordingly, the present embodiment relates to a method and apparatus for mounting a component in a computer chassis. The present embodiment includes an embodiment in which the component is associated with a heat sink. A mounting bracket, including at least one slot, is disposed on a component. At least one fastener affixes the mounting bracket and component to the chassis. In an alternative embodiment, the component can be secured to an interposer plate affixed to the chassis. The plate includes threaded openings for engaging the fasteners. A second supporting means engages the mounting bracket also. In the present embodiment, the second supporting means is a cover including at least one tab. When the cover is coupled with the chassis, the tabs align with and engage the slots of the mounting bracket. A guide is described for aligning an electrical connector of the component with a corresponding connector of the computer, wherein the connectors make the electrical connection as the component is secured to the chassis.
A principal advantage of the above apparatus are that it requires less space and minimizes airflow restrictions and stress on the motherboard. Other advantages of the method and apparatus are that they create a more stable support for the component, and help seat the component properly. Yet another advantage is that it is a simpler design, thus easier to manufacture.
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Cook Stephen
Hernandez Gilberto
Jeffries John
Dell USA L.P.
Donels Jeffrey
Haynes and Boone L.L.P.
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