Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate
2011-02-24
2011-12-06
Nguyen, Vinh (Department: 2858)
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
C324S750300
Reexamination Certificate
active
08072233
ABSTRACT:
A method for monitoring a semiconductor fabrication process creates a wafer of semiconductor chips. Each chip has a one or more diodes. Each diode is addressable as part of an array, corresponds to a physical location of the chip, and is connected in series to a stack. The stack is composed of one ore more vertical interconnects and metal contacts. The diode and associated stack of vertical interconnects is addressed, and the current through each of the stacks of vertical interconnects in an array is measured.
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International PCT Search Report and Written Opinion, PCT/US2008/067595, 13 pages, Sep. 30, 2008.
Stevens Tommy
Yach Randy
King & Spalding L.L.P.
Microchip Technology Incorporated
Nguyen Vinh
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