Method and apparatus for monitoring plasma conditions using...

Details Method and apparatus for monitoring plasma conditions using... Method and apparatus for monitoring plasma conditions using...

2007-06-26

2007-06-26

Kackar, Ram N. (Department: 1763)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With measuring, sensing, detection or process control means

C156S345340, C156S345250, C156S345260, C156S345270, C118S712000, C204S192100, C204S298010

Reexamination Certificate

active

10788328

ABSTRACT:
A plasma processing system is provided that allows for monitoring a plasma processing system during plasma processing. The plasma processing system includes a processing chamber and a monitoring system for monitoring conditions of the processing chamber. By providing tools within a tool housing that is protected from the plasma environment but still in very close proximity thereto, better process monitoring can be achieved.

REFERENCES:
patent: 2001/0015175 (2001-08-01), Masuda et al.
patent: 2001/0047760 (2001-12-01), Moslehi
patent: 2003/0164226 (2003-09-01), Kanno et al.
patent: 06204143 (1994-07-01), None
patent: 2001093882 (2001-04-01), None

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