Data processing: generic control systems or specific application – Specific application – apparatus or process – Product assembly or manufacturing
Reexamination Certificate
2006-01-10
2006-01-10
Rodriguez, Paul (Department: 2125)
Data processing: generic control systems or specific application
Specific application, apparatus or process
Product assembly or manufacturing
C700S096000, C700S115000, C705S028000
Reexamination Certificate
active
06985787
ABSTRACT:
The present invention presents an improved apparatus and method for monitoring parts in a material processing system, wherein the material processing system includes a processing tool, a number of RF-responsive part identifiers coupled to the processing tool to generate and transmit part ID data, and a sensor interface assembly (SIA) configured to receive the part ID data from the plurality of RF-responsive part identifiers.
REFERENCES:
patent: 5995046 (1999-11-01), Belcher et al.
patent: 6047579 (2000-04-01), Schmitz
patent: 6121926 (2000-09-01), Belcher et al.
patent: 6459726 (2002-10-01), Ovard et al.
patent: 6618640 (2003-09-01), Hittner et al.
patent: 6693432 (2004-02-01), Kraz
patent: 6898558 (2005-05-01), Klekotka
patent: 2002/0008621 (2002-01-01), Barritz et al.
patent: 2002/0014963 (2002-02-01), Trosper
patent: 2002/0080032 (2002-06-01), Smith et al.
patent: 2002/0087867 (2002-07-01), Oberle et al.
patent: 2003/0043027 (2003-03-01), Carson et al.
patent: 2003/0069648 (2003-04-01), Douglas et al.
patent: 2003/0130912 (2003-07-01), Davis et al.
patent: 2003/0233161 (2003-12-01), Cheng et al.
patent: 2004/0007326 (2004-01-01), Roche et al.
patent: 2004/0041714 (2004-03-01), Forster
patent: 2004/0126906 (2004-07-01), Klekotka
patent: 2004/0127030 (2004-07-01), Klekotka
patent: 2004/0127031 (2004-07-01), Klekotka
patent: 2004/0128021 (2004-07-01), Klekotka
patent: 2005/0067102 (2005-03-01), Baldwin et al.
patent: WO 01/82009 (2001-11-01), None
patent: WO 01/95242 (2001-12-01), None
patent: WO 02/17030 (2002-02-01), None
patent: WO 2004/059405 (2004-07-01), None
U.S. Appl. No. 60/378,384.
Rodriguez Paul
Tokyo Electron Limited
LandOfFree
Method and apparatus for monitoring parts in a material... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for monitoring parts in a material..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for monitoring parts in a material... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3574253