Method and apparatus for monitoring cracking using stress wave e

Details Method and apparatus for monitoring cracking using stress wave e Method and apparatus for monitoring cracking using stress wave e

1979-03-02

1980-06-17

Ciarlante, Anthony V.

Measuring and testing

Vibration

By mechanical waves

G01N 2904

Patent

active

042077710

ABSTRACT:
The disclosure is directed to a technique for monitoring signals emanating from a ceramic article (10) during a soldering operation. In order to determine whether the signals are stress wave emissions (SWE's) or noise the number of pulses (41) of the monitored signal having an amplitude exceeding a preset threshold (51), during a period of time, are counted. A count (62) proportional to the area under the envelope of the detected signal during the period of time is also made. A ratio of the count related to the area under the envelope to the pulse count is formed and compared to an empirically developed range of ratios which are indicative of a stress wave emission signal.

REFERENCES:
patent: 3713127 (1973-01-01), Kelroy et al.
patent: 3858439 (1975-01-01), Nakamura
patent: 3903512 (1975-09-01), Laymon
patent: 3924456 (1975-12-01), Vahaviolos
patent: 4054867 (1977-10-01), Owens
patent: 4086816 (1978-05-01), Jon et al.

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