Method and apparatus for monitoring a process by employing...

Details Method and apparatus for monitoring a process by employing... Method and apparatus for monitoring a process by employing...

2005-05-24

2005-05-24

Goudreau, George A. (Department: 1763)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With measuring, sensing, detection or process control means

C156S345250, C118S7230ER

Reexamination Certificate

active

06896763

ABSTRACT:
A method and apparatus for monitoring a process by employing principal component analysis are provided. Correlated attributes are measured for the process to be monitored (the production process). Principal component analysis then is performed on the measured correlated attributes so as to generate at least one production principal component; and the at least one production principal component is compared to a principal component associated with a calibration process (a calibration principal component). The calibration principal component is obtained by measuring correlated attributes of a calibration process, and by performing principal component analysis on the measured correlated attributes so as to generate at least one principal component. A principal component having a feature indicative of at least one of a desired process state, process event and chamber state then is identified and is designated as the calibration principal component.

REFERENCES:
patent: 4312732 (1982-01-01), Degenkolb et al.
patent: 5288367 (1994-02-01), Angell et al.
patent: 5653894 (1997-08-01), Ibbotson et al.
patent: 5658423 (1997-08-01), Angell et al.
patent: 5711843 (1998-01-01), Jahns
patent: 5885472 (1999-03-01), Miyazaki et al.
patent: 5966586 (1999-10-01), Hao
patent: 6017414 (2000-01-01), Koemtzopoulos et al.
patent: 6153115 (2000-11-01), Le et al.
patent: 6368975 (2002-04-01), Balasubramhanya et al.
patent: 6381008 (2002-04-01), Branagh et al.
patent: 6413867 (2002-07-01), Sarfaty et al.
patent: 6521080 (2003-02-01), Balasubramhanya et al.
Han Chen and D.S. Boning, “Data-Rich Multivariate Time-Series Detection/Diagnosis Using Extensions to Principal Components Analysis”, SIMA/LFM Workshop on Industrial Diagnostics (15 pp) (May 6, 1998).
Technical Presentation, “Eigensystem Trend Analysis (ETA),” Verity Instruments, Inc. (5pp) (Feb. 24, 1999).
The EP2000 Plasma Diagnostic System Datasheet, CETAC Corporation, pp. 2-5.

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