Method and apparatus for molding substrate

Details Method and apparatus for molding substrate Method and apparatus for molding substrate

2009-11-13

2011-11-22

Davis, Robert B (Department: 1743)

Coating apparatus

With treatment of coating material

By agitation

C222S146100, C222S526000, C222S572000, C366S184000

Reexamination Certificate

active

08062424

ABSTRACT:
A method for encapsulating a substrate includes placing a hardened encapsulant material in a container. The encapsulant material is then heated and stirred until it is in a liquid or gel state. The liquid encapsulant material is held in the container in a vacuum state and dispensed over semiconductor dies along a guide, which allows the liquid encapsulant material to cool slightly before it covers a die.

REFERENCES:
patent: 1989800 (1935-02-01), Gustin
patent: 3239199 (1966-03-01), Jameson
patent: 3253303 (1966-05-01), Bradt
patent: 3291672 (1966-12-01), Sonneborn et al.
patent: 3412431 (1968-11-01), Lemelson
patent: 3717121 (1973-02-01), Bruckbauer et al.
patent: 5100699 (1992-03-01), Roeser
patent: 6527430 (2003-03-01), Osborn

Affiliated with

Also associated with

Rating

Method and apparatus for molding substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for molding substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for molding substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4269773