Method and apparatus for molding bead

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C156S079000, C264S045400, C264S045900

Reexamination Certificate

active

10819178

ABSTRACT:
A hollow bead of high quality is applied and molded into a shape corresponding to and following a shape of an applying position onto which the bead is to be applied. A bead-molding apparatus includes a discharging device of a double nozzle structure comprised of an inner nozzle and an outer nozzle, a highly viscous material feed unit for feeding a highly viscous material that is fluid in a form of a stream in a high speed flow region and can retain a shape into which it is applied and molded in a low speed flow region, a manipulator disposed so as to transfer the discharging device mounted thereon to a desired position, and a controller for controlling overall operations of the apparatus. The discharging device is controlled so as to move along the applying position of a member while feeding gases thereto from the inner nozzle and discharging the highly viscous material thereto from the outer nozzle.

REFERENCES:
patent: 3635632 (1972-01-01), Shaw et al.
patent: 3901958 (1975-08-01), Doll
patent: 4303736 (1981-12-01), Torobin
patent: 4434250 (1984-02-01), Kessler
patent: 4744932 (1988-05-01), Browne
patent: 4809885 (1989-03-01), Hayashi et al.
patent: 5089190 (1992-02-01), Trevathan et al.
patent: 5368458 (1994-11-01), Addeo et al.
patent: 5402351 (1995-03-01), Batchelder et al.
patent: 5979794 (1999-11-01), DeFillipi et al.
patent: 50-53464 (1975-05-01), None
patent: 5-69469 (1993-03-01), None
patent: 9-174655 (1997-07-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and apparatus for molding bead does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for molding bead, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for molding bead will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3817649

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.