Method and apparatus for molding a synthetic resin lens for a li

Plastic and nonmetallic article shaping or treating: processes – Optical article shaping or treating – Composite or multiple layer

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

249 85, 249 96, 26427216, 26427217, 264275, 425121, 425808, B29D 1100

Patent

active

044863640

ABSTRACT:
A lens for a light emitting diode is formed by inserting a pair of lead frames into a mold having grooves for snugly receiving the outer free ends of the lead frames. The outer-most edge of the lead frame free ends engage the base of the mold, thereby precisely locating the light emitting element, mounted on the lead frames, relative to the top surface of the lens. The snug fit for the outer free ends assures that the outer free ends are free of the resin to facilitate alignment of the finished product in an electro-optical circuit and to provide improved radiation of heat to the atmosphere.

REFERENCES:
patent: 3484536 (1969-12-01), Jaeschke et al.
patent: 3805347 (1974-04-01), Collins et al.
patent: 3806766 (1974-04-01), Fanning
patent: 3855606 (1974-12-01), Schoberl
patent: 4152624 (1979-05-01), Knaebel
patent: 4188708 (1980-02-01), Frederiksen

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and apparatus for molding a synthetic resin lens for a li does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for molding a synthetic resin lens for a li, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for molding a synthetic resin lens for a li will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1581621

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.