Method and apparatus for molding a semiconductor device

Details Method and apparatus for molding a semiconductor device Method and apparatus for molding a semiconductor device

2007-07-10

2007-07-10

Davis, Robert B. (Department: 1722)

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

To produce composite, plural part or multilayered article

C264S313000, C264S316000, C425S089000, C425S125000, C425S127000, C438S127000

Reexamination Certificate

active

10876922

ABSTRACT:
A method and apparatus is provided for molding a semiconductor device in a mold including two mold halves. One mold half includes a compressible sealing mechanism constructed and configured to exert a sealing pressure between a surface of the mold half and a surface of a semiconductor device located in the mold. A compliant tape is positionable onto the mold half comprising the sealing mechanism between the semiconductor device and the sealing mechanism for molding of the semiconductor device.

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