Method and apparatus for modifying wire-wrapped back planes

Electricity: conductors and insulators – Conduits – cables or conductors – Single duct conduits

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

29628, 317101CC, 317101CM, 339 18C, H05K 104

Patent

active

039353729

ABSTRACT:
An improved circuit modification method is provided for wire-wrapped electrical back planes such that changes in the back plane circuitry may be accomplished in areas remote from a production facility where wire-wrap equipment and highly skilled technicians may not be available, such method involving the preparation of a slip-on, post-terminal-compatible printed circuit board at the production facility, delivery of the printed circuit board to the remote area, and the slip-on attachment of the printed circuit board onto the post terminals of the back plane by a repairman who may be unfamiliar with the intricacies of the back plane and its wire-wrapped interconnections, said slip-on printed circuit board being inherently provided with whatever guidance may be required by the repairman in effectuating its installation on the back plane.

REFERENCES:
patent: 2965812 (1960-12-01), Bedford, Jr.
patent: 3083261 (1963-03-01), Francis et al.
patent: 3279040 (1966-10-01), Propster, Jr.
patent: 3296362 (1967-01-01), Parry
patent: 3405324 (1968-10-01), Alexander et al.
patent: 3509268 (1970-04-01), Schwartz et al.
patent: 3591922 (1971-07-01), Pardee et al.
patent: 3660726 (1972-05-01), Preston et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and apparatus for modifying wire-wrapped back planes does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for modifying wire-wrapped back planes, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for modifying wire-wrapped back planes will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1812720

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.