Method and apparatus for modifying circuit having ball grid arra

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

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Details

361772, 439 83, H01R 909

Patent

active

059090111

ABSTRACT:
In aspect, the present invention is directed to a pad connector including a substantially flat pad portion, and a tail portion having a top portion attached to the pad portion and a bottom portion. The tail portion is angulated with respect to the pad portion. In another aspect, the present invention is directed to a method of modifying a circuit board having at least one Ball Grid Array (BGA). The method includes removing the via portion of the BGA pad from the circuit board to sever the connection between the via and the circuit, attaching the pad connector to the circuit board, and connecting the pad connector to the circuit of the circuit board.

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