Static information storage and retrieval – Interconnection arrangements – Magnetic
Reexamination Certificate
2000-07-06
2001-07-10
Nguyen, Tan T. (Department: 2818)
Static information storage and retrieval
Interconnection arrangements
Magnetic
C365S063000, C365S206000
Reexamination Certificate
active
06259621
ABSTRACT:
FIELD OF THE INVENTION
This invention relates generally to the field of semiconductor devices and specifically to a method and apparatus for minimization of data line coupling in a semiconductor memory device.
BACKGROUND OF THE INVENTION
As Dynamic Random Access Memories (DRAM) grow larger and are built with smaller geometries, undesirable parasitic capacitances between lengthy conductors are becoming more prevalent. A simple diagram of a portion of a DRAM integrated circuit is shown in
FIGS. 1A and 1B
. The disclosed DRAM includes several subarrays
16
, each of which contains a portion of the memory array. Thus, for example, a 16M-bit memory array might be broken up into
64
256K-bit subarrays. As one of skill in the art of DRAM architecture will understand, the columns
14
, or digit lines, in the subarrays
16
in
FIGS. 1A and 1B
run from up and down and the rows in the subarrays run left to right (not shown).
The digit lines
14
connect to sense amps
13
which reside between the subarrays
16
, and the rows connect to row decodes
15
which also reside between the subarrays
16
. As is commonplace in the industry, the digit lines
14
are arranged such that a particular sense amp
13
receives a complementary (opposite) pair of logic signals, represented in
FIG. 1B
as DIGIT and DIGIT*. For example, when DIGIT=logic ‘1’ (typically 5 Volts or less), DIGIT*=logic ‘0’ (typically 0 Volts), and vice versa. After sensing, and when a given digit line pair
14
is selected by the application of signal CS, the logic of digit lines DIGIT and DIGIT* are transferred to the I/O lines
17
that run through the sense amps
13
. Like the digit lines
14
, the I/O lines
17
are also complementary, as represented by I/O and I/O*. If these I/O lines
17
appear within a selected section, as denoted by the application of signal “SECTION,” they are transferred, again in complementary form, to the data lines
18
which run along side the row decodes
15
. (“Data lines” should be interpreted for purposes of this disclose as distinct from the “digit lines” that appear within the subarrays). Ultimately, the data line pairs
18
are input into a data line amplifier
19
, which in turn sends a selected data line
18
(selection not shown) to the data path
20
which interfaces with the rest of the DRAM's peripheral circuitry. In a preferred embodiment, the data line pairs
18
constitute conductors that run along side the row decode
15
before making contact with the data line amplifier
19
. These data line pairs
18
together constitute a data line bus
21
.
It is known in the prior art that as the length of conductors increases and as the spacing between them decreases that the capacitive coupling between conductors increases, thus negatively affecting the speed at which signals can be conducted. Heretofore, this problem has been particularly acute with respect to the digit lines
14
in the array, which are typically very long, very thin, and spaced at minimum distances with respect to one another. Accordingly, the prior art has employed methods of “twisting” the digit lines
14
to try and reduce the effects of parasitic capacitance between digit lines.
As shown in
FIG. 2A
, which can be described as a non-twisted architecture for the digit lines
14
, a “worst case” and “best case” scenario with respect to the parasitic capacitance
26
can be obtained. In the worst case, the effect of parasitic capacitance
26
is maximized. For example, suppose a ‘1’ logic state appears on digit line Digit
0
. In this case, Digit
0
* will necessarily be held at a complementary ‘0’ logic state. If Digit
1
* is also held at logic ‘0,’ then Digit
0
will be surrounded for its entire length by digit lines of the opposite data states. Because Digit
0
is completely surrounded on both sides by the opposite logic state, the ability to transport a logic ‘1’ is negatively affected to the greatest extent possible. The coupling coefficient of Digit
0
for this worse case scenario can be defined as C=1.
In the best case, the effect of parasitic capacitance
26
is minimized. For example, suppose a ‘1’ logic state appears on digit line Digit
3
*, and that adjacent digit line Digit
2
is also held at ‘1.’ Although the complementary digit line Digit
3
is necessarily at the opposite logic state, the fact that there is no voltage difference between Digit
3
* and Digit
2
works to effectively eradicate the parasitic capacitance
26
between these two digit lines. Hence, Digit
3
* can be accessed faster than Digit
0
(i.e., the worst case) due to the reduction in parasitic capacitance. Because Digit
3
* is surrounded on only one side by the opposite logic state, the coupling coefficient of this best case scenario can be defined as C=0.5.
It is known in the prior art that the digit line pairs
14
can be twisted to reduce the effect of intra digit line pair capacitance, i.e., between a given digit line and its complement. A prior art architecture that achieves this result is shown in FIG.
2
B. This twisting architecture is interesting in that it has no best or worse case. Regardless of the status of the digit lines, a coupling coefficient of C=0.75 will always result. If we take digit line Digitl=‘1’ as an example, we see that Digit
1
is always bordered by Digit
1
*=‘0’ on one side. Because this potential difference occurs for the entire length of Digit
1
, Digit
1
* contributes C=0.5 to the coupling coefficient of Digit
1
. On the side of Digit
1
that is not adjacent to Digit
1
*, we see that Digit
1
meets with Digit
2
=‘1’ for one-fourth of its length (which contributes nothing to the coupling coefficient because there is no potential difference between Digit
1
and Digit
2
), and meets with Digit
2
*=‘0’ for one-fourth of its length. Thus, Digit
2
* contributes another C=0.125 to the coupling coefficient of Digit
1
for a total of C=0.625. Likewise, Digit
1
meets with Digit
0
* for one-fourth of its length, which contributes another C=0.125 to the coupling coefficient of Digit
1
for a total of C=0.75. If the logic states of Digit
2
and Digit
2
* or Digit
0
and Digit
0
are changed to ‘0’ and ‘1’ respectively, the nature of the coupling with respect to Digit
1
does not change, because Digit
1
will still “see” a logic state of ‘0’ on one full side and half of its other side. Hence, using the twisting architecture of
FIG. 2B
, the coupling coefficient of any digit line is C=0.75. This provides a benefit over the non-twisted architecture of
FIG. 2A
in that the amount of coupling, and hence the rate at which the digit lines can be accessed, are constant. However, the twisting architecture of
FIG. 2B
, while providing constant coupling, also tends to slow access to the digit lines down. In effect, the architecture of
FIG. 2B
averages the coupling, and indirectly the speed, of the digit lines when compared with the non-twisted architecture of FIG.
2
A.
Another digit line twisting architecture that is known in the art is shown in FIG.
2
C. This architecture has been used on DRAM products manufactured by Micron Technology, Inc., including part number MT48LC16M4 (16M×4 synchronous DRAM). As used on these Micron DRAMs, a single twist
24
appears at the center of the subarray
16
that the digit lines
14
are contained in. This architecture has the benefit of reducing that portion of the coupling coefficient that is provided by a given digit line's complement. The architectures of
FIGS. 2A and 2B
show that any given digit line is always bordered on one full side by its complement. The architecture of
FIG. 2C
reduces this intra digit line capacitance by physically separating a given digit line and its complement for at least a portion of the digit line's progression through the subarray.
In contrast to the digit lines, a problem that is arising in modern day DRAMs is that the data lines
18
are becoming longer. As can be seen in
FIG. 1A
, the data bus
21
runs along several
Li Wen
Ma Manny K.
Howery Simon Arnold & White LLP
Micro)n Technology, Inc.
Nguyen Tan T.
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