Method and apparatus for microwave interconnection

Details Method and apparatus for microwave interconnection Method and apparatus for microwave interconnection

2006-02-14

2006-02-14

Pascal, Robert (Department: 2817)

Wave transmission lines and networks

Long line elements and components

Connectors and interconnections

C333S02400C, C333S247000, C333S238000

Reexamination Certificate

active

06998944

ABSTRACT:
Microwave signals are coupled from a microwave module to a microstrip transmission line, each installed on a chassis plate. The microwave signals are fed through the bottom or side of the microwave module using a feedthrough pin mounted in the module. The feedthrough pin extends from the microwave module interior into a channel defined in the chassis plate and to a microstrip line on the opposite side of the plate. An electrically conductive gasket is placed about the feedthrough pin between the microwave module and chassis plate to reduce signal leakage and enhance ground continuity. An insulating sleeve is installed about the feedthrough pin in the chassis plate channel and provides a nominal clearance (e.g., 0.005 inches) within that channel to allow for manufacturing and assembly tolerances and to enable feedthrough impedance to be substantially insensitive to the position of the feedthrough pin and insulating sleeve within the channel.

REFERENCES:
patent: 2527146 (1950-10-01), Mumford
patent: 2762991 (1956-09-01), Chlavin
patent: 3784726 (1974-01-01), Smith et al.
patent: 4782313 (1988-11-01), Brant, Jr.
patent: 4837529 (1989-06-01), Gawronski et al.
patent: 4951011 (1990-08-01), Heckaman et al.
patent: 4975065 (1990-12-01), Rosenberg et al.
patent: 5019829 (1991-05-01), Heckman et al.
patent: 5311408 (1994-05-01), Ferchau et al.
patent: 5363075 (1994-11-01), Fanucchi
patent: 5453750 (1995-09-01), Battista et al.
patent: 5563562 (1996-10-01), Szwec
patent: 5619399 (1997-04-01), Mok
patent: 5633615 (1997-05-01), Quan
patent: 5696474 (1997-12-01), Spivey et al.
patent: 5797765 (1998-08-01), Barnett et al.
patent: 5963111 (1999-10-01), Anderson et al.
patent: 5986519 (1999-11-01), Kellett et al.
patent: 5994975 (1999-11-01), Allen et al.
patent: 6028497 (2000-02-01), Allen et al.
patent: 6076017 (2000-06-01), Taylor et al.
patent: 6102709 (2000-08-01), Howard et al.
patent: 6111474 (2000-08-01), Nibe
patent: 6166615 (2000-12-01), Winslow et al.
patent: 6417747 (2002-07-01), Dearden et al.
patent: 6878872 (2005-04-01), Lloyd et al.

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