Method and apparatus for microwave heat-treatment of a semicondu

Details Method and apparatus for microwave heat-treatment of a semicondu Method and apparatus for microwave heat-treatment of a semicondu

1985-10-02

1987-05-19

Leung, Philip H.

Electric heating

Metal heating

Of cylinders

219 1055F, 219 1055A, 148 15, 118 501, 118728, 427 451, H05B 678

Patent

active

046670769

ABSTRACT:
The present invention relates to a method of heat-treating a semiconductor wafer by utilizing an electromagnetic wave. The wafer is floated by the blast of a gas and is held in a non-contacting state, and the electromagnetic wave, such as microwave, is projected on the wafer in this state so as to heat it. According to the present invention, only the wafer is heated and, hence, the wafer can be heat-treated uniformly and efficiently with great precision.

REFERENCES:
patent: 3521018 (1970-07-01), Boerger et al.
patent: 3699298 (1972-10-01), Briody
patent: 4138306 (1979-02-01), Niwa
patent: 4254319 (1981-03-01), Beh et al.
patent: 4456806 (1984-06-01), Arimatsu
patent: 4474625 (1984-10-01), Cohen et al.
patent: 4490183 (1984-12-01), Scovell
patent: 4593168 (1986-06-01), Amada

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