Method and apparatus for microminiaturized header assembly

Details Method and apparatus for microminiaturized header assembly Method and apparatus for microminiaturized header assembly

1989-03-17

1990-04-10

Desmond, Eugene F.

Electrical connectors

Metallic connector or contact also having securing part...

Multipart assembly

29882, 439936, H01R 1105

Patent

active

049156578

ABSTRACT:
A header assembly for use in making electrical contact through the wall or bulkhead of a device such as a laser gyro which utilizes standard available components and is constructed in accordance with standard available procedures so as to effectuate a lower cost-effective header.

REFERENCES:
patent: 4253234 (1981-03-01), Niles et al.
Brochure, TRW Worldwide Connectors, ".050" Density Solder Cup/Wire D-Microminiature connector", p. 309, TRW, Inc.

Affiliated with

Also associated with

Rating

Method and apparatus for microminiaturized header assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for microminiaturized header assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for microminiaturized header assembly will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2297052