Method and apparatus for membrane deposition

Details Method and apparatus for membrane deposition Method and apparatus for membrane deposition

2011-08-30

2011-08-30

Tadesse, Yewebdar T (Department: 1717)

Coating apparatus

Immersion or work-confined pool type

Work-confined pool

C118S050000, C118S428000, C118S429000

Reexamination Certificate

active

08006637

ABSTRACT:
A method and apparatus for applying a uniform membrane coating to a substrate, such as a honeycomb structure, having a plurality of through-channels, wherein the through-channels have an average diameter of less than or equal to 3 mm. The method includes providing a liquid precursor comprising membrane-forming materials to the substrate and applying a pressure differential across the substrate. The pressure differential causes the liquid precursor to travel uniformly through the through-channels, depositing the membrane-forming materials on the walls of the through-channels and forming the membrane on the walls of the through-channels. The apparatus includes a chamber capable of holding the substrate and of maintaining a pressure differential across the plurality of through-channels.

REFERENCES:
patent: 4039482 (1977-08-01), Hoyer et al.
patent: 4208454 (1980-06-01), Reed et al.
patent: 4719058 (1988-01-01), Komoda
patent: 6509060 (2003-01-01), Komoda et al.
patent: 6627257 (2003-09-01), Foerster et al.
patent: 7094728 (2006-08-01), Yan et al.
patent: 7608298 (2009-10-01), Tanaka
patent: 2004/0001919 (2004-01-01), Aderhold et al.
patent: 0428990 (1990-11-01), None
patent: 0980710 (2002-02-01), None
patent: 2385008 (2003-08-01), None

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