Semiconductor device manufacturing: process – With measuring or testing
Reexamination Certificate
2005-03-03
2008-09-23
Thomas, Tom (Department: 2829)
Semiconductor device manufacturing: process
With measuring or testing
C438S015000, C438S016000, C702S097000, C702S170000
Reexamination Certificate
active
07427520
ABSTRACT:
A memory (43) of a control unit (4) stores correction data (81) indicating a relationship between a decrement in a measurement value of a film thickness by removal of organic contamination adsorbed onto a substrate and an amount of adsorbed organic contamination corresponding to a difference between a true film thickness and the measurement. The difference is caused by organic contamination adsorbed onto the substrate before removal of organic contamination. In a film-thickness measuring apparatus (1), a calculating/measuring part41obtains a first measurement value of a film thickness on a substrate (9) using an ellipsometer (23), and further obtains a second measurement value which is affected by remaining organic contamination after organic contamination adsorbed onto the substrate (9) is removed by an organic contamination remover (3). A film-thickness calculator (42) obtains an amount of adsorbed organic contamination before removal of organic contamination based on the first and second measurement values and the correction data (81). A thickness of the thin film formed on the substrate (9) is accurately obtained based on the first measurement value and the amount of adsorbed organic contamination before removal of organic contamination.
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Kitajima Toshikazu
Kono Motohiro
Nakazawa Yoshiyuki
Dainippon Screen Mfg. Co,. Ltd.
McDermott Will & Emery LLP
Thomas Tom
Tillie Chakila
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