Method and apparatus for measuring thickness of thin film...

Details Method and apparatus for measuring thickness of thin film... Method and apparatus for measuring thickness of thin film...

2008-09-23

2008-09-23

Thomas, Tom (Department: 2829)

Semiconductor device manufacturing: process

With measuring or testing

C438S015000, C438S016000, C702S097000, C702S170000

Reexamination Certificate

active

11069996

ABSTRACT:
A memory (43) of a control unit (4) stores correction data (81) indicating a relationship between a decrement in a measurement value of a film thickness by removal of organic contamination adsorbed onto a substrate and an amount of adsorbed organic contamination corresponding to a difference between a true film thickness and the measurement. The difference is caused by organic contamination adsorbed onto the substrate before removal of organic contamination. In a film-thickness measuring apparatus (1), a calculating/measuring part41obtains a first measurement value of a film thickness on a substrate (9) using an ellipsometer (23), and further obtains a second measurement value which is affected by remaining organic contamination after organic contamination adsorbed onto the substrate (9) is removed by an organic contamination remover (3). A film-thickness calculator (42) obtains an amount of adsorbed organic contamination before removal of organic contamination based on the first and second measurement values and the correction data (81). A thickness of the thin film formed on the substrate (9) is accurately obtained based on the first measurement value and the amount of adsorbed organic contamination before removal of organic contamination.

REFERENCES:
patent: 6146541 (2000-11-01), Goldstein et al.
patent: 6261853 (2001-07-01), Howell et al.
patent: 6303397 (2001-10-01), Chen et al.
patent: 6325078 (2001-12-01), Kamieniecki
patent: 6519045 (2003-02-01), Kwon
patent: 2002/0102748 (2002-08-01), Kwon
patent: 2003/0160972 (2003-08-01), Chen et al.
patent: 11-297689 (1999-10-01), None
patent: 2002-93871 (2002-03-01), None

Affiliated with

Also associated with

Rating

Method and apparatus for measuring thickness of thin film... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for measuring thickness of thin film..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for measuring thickness of thin film... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3912159