Method and apparatus for measuring thermal warpage

Details Method and apparatus for measuring thermal warpage Method and apparatus for measuring thermal warpage

1994-06-14

1997-02-11

Gutierrez, Diego F. F.

Thermal measuring and testing

Thermal testing of a nonthermal quantity

Of susceptibility to thermally induced deteriouration, flaw,...

250237G, 356374, 356376, G01N 1700, G01N 360, G01B 1124, G01B 1130

Patent

active

056013647

ABSTRACT:
A method and apparatus for measuring thermally induced warpage in test elements such as printed wiring boards and printed wiring assemblies, including a heating chamber having a transparent window and support structure for supporting a printing wiring board in an observation orientation and position parallel to the transparent window. A glass grating placed adjacent the window and a light source shines through the window onto the printed wiring board under test. A camera is positioned for capturing images of shadow moire fringes formed over time as the oven heats up the printed wiring board or printed wiring assembly to simulate actual process conditions. A computer is used for controlling operation of the apparatus and for evaluating the captured images of the moire fringes in relation to the temperature as a function of time.

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