Method and apparatus for measuring the thicknesses of layers of

Details Method and apparatus for measuring the thicknesses of layers of Method and apparatus for measuring the thicknesses of layers of

1994-06-21

1996-06-04

Gonzalez, Frank

Optics: measuring and testing

By dispersed light spectroscopy

Utilizing a spectrometer

356346, 356357, G01B 1102, G01B 902

Patent

active

055238408

ABSTRACT:
An interference waveform dispersion spectrum of light reflected from a multi-layer film is compared to a waveform obtained by numerical calculation using an optical characteristic matrix. Respective layer thickness values obtained from the calculated analysis of the Spatial interference waveform are subjected to waveform fitting with actually measured values. The theoretical interference spectrum is recalculated while changing approximate values of the layer thicknesses until a match is obtained to obtain precise respective layer thicknesses. The thicknesses of respective layers of a thin multi-layer film of submicron thicknesses can be non-destructively measured exactly and stably without direct contact.

REFERENCES:
patent: 4707611 (1987-11-01), Southwell
patent: 5100233 (1992-03-01), Southwell et al.
patent: 5227861 (1993-07-01), Nishizawa et al.
patent: 5371596 (1994-12-01), Hattori et al.
patent: 5414506 (1995-05-01), Saisho et al.

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