Method and apparatus for measuring temperatures during electroni

Details Method and apparatus for measuring temperatures during electroni Method and apparatus for measuring temperatures during electroni

1998-11-23

2000-08-22

Jeffery, John A.

Electric heating

Heating devices

Combined with container, enclosure, or support for material...

392416, 374121, 438 5, 438 26, 438123, H01L 21205

Patent

active

061076066

ABSTRACT:
A novel technique for measuring the temperature of an electronic circuit undergoing assembly packaging processes includes a non-contact infrared detector which is used to measure the temperature of the die allowing a control systems to directly adjust the die temperature. Previous to this invention, the die temperatures were controlled indirectly, typically by controlling ambient temperature in an oven or furnace to a series of set point values during curing of the electronic packaging materials.

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patent: 5985678 (1999-11-01), Kiyama

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