Method and apparatus for measuring stress in a film applied to s

Details Method and apparatus for measuring stress in a film applied to s Method and apparatus for measuring stress in a film applied to s

1994-04-08

1994-11-29

Nelms, David C.

Radiant energy

Photocells; circuits and apparatus

Optical or pre-photocell system

356376, G01V 904

Patent

active

053692861

ABSTRACT:
A method for measuring surface topography characterized by making multiple scans of the surface with a laser scanning unit and utilizing the multiple scans to create representations of the surface's topography. The surface topography data can also be used to calculate the compressive or tensile stress caused by a thin film applied to the surface of a semiconductor wafer. The apparatus of the present invention scans a laser beam across a surface in an x direction, and detects displacements of a reflected portion of the laser beam in a z direction. A pair of photodetectors are used to translate z direction displacements of the reflected beam into analog signals which are digitized and input into a microcomputer for analysis. The multiple scans of the surface are preferably accomplished by placing the workpiece on a pedestal which can be rotated to various angular positions.

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