Method and apparatus for measuring shape or thickness...

Optics: measuring and testing – By light interference – For dimensional measurement

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C356S511000

Reexamination Certificate

active

08068234

ABSTRACT:
An interferometer system and method may be used to measure substrate thickness or shape. The system may include two spaced apart reference flats having that form an optical cavity between two parallel reference surfaces. A substrate holder may be configured to place the substrate in the cavity with first and second substrate surfaces substantially parallel with corresponding first and second reference surfaces such that a space between the first or second substrate surface is three millimeters or less from a corresponding one of the reference surfaces or a damping surface. Interferometer devices may be located on diametrically opposite sides of the cavity and optically coupled thereto. The interferometers can map variations in spacing between the substrate surfaces and the reference surfaces, respectively, through interference of light optically coupled to and from to the cavity via the interferometer devices.

REFERENCES:
patent: 6504615 (2003-01-01), Abe et al.
patent: 6764380 (2004-07-01), Wiswesser et al.
patent: 6847458 (2005-01-01), Freischlad et al.
patent: 7009696 (2006-03-01), Sullivan et al.
patent: 7057741 (2006-06-01), Mueller et al.
patent: 7340962 (2008-03-01), Ueki
patent: 2004/0184038 (2004-09-01), Freischlad et al.
patent: 2007/0229842 (2007-10-01), Jansen
SPIE, Advanced Characterization Techniques for Optics, Semiconductors, and Nanotechnologies III, No. 6672-1, San Diego, USA, Aug. 2007.
The International Search Report and The Written Opinion of the International Searching Authority dated Sep. 17, 2010 issued for the International patent application No. PCT/US2010/024305.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and apparatus for measuring shape or thickness... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for measuring shape or thickness..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for measuring shape or thickness... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4310227

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.