Method and apparatus for measuring position of pattern formed on

Details Method and apparatus for measuring position of pattern formed on Method and apparatus for measuring position of pattern formed on

1996-01-02

1997-09-23

Nelms, David C.

Optics: measuring and testing

By polarized light examination

With light attenuation

356371, 25055929, G01B 1130

Patent

active

056710542

ABSTRACT:
The thickness of a substrate is one of the most important parameters in detecting the flexure of the substrate. The thickness of a reference substrate disposed on a stage and its amount of flexure are measured. Thus measured data are stored in a memory of apparatus. Then, the apparatus measures the thickness of a substrate to be measured. The data concerning thus measured thickness of the substrate to be measured and the data concerning the thickness and amount of flexure of the reference substrate stored in the memory are utilized to calculate the amount of flexure of the substrate to be measured. This apparatus measures the pattern position of the substrate to be measured in thus flexed state. The apparatus corrects thus measured pattern position of the substrate to be measured on the basis of the amount of flexure which has been indirectly measured as mentioned above.

REFERENCES:
patent: 5459577 (1995-10-01), Ototake et al.
patent: 5539521 (1996-07-01), Otokate et al.

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