Method and apparatus for measuring optical overlay deviation

Details Method and apparatus for measuring optical overlay deviation Method and apparatus for measuring optical overlay deviation

2007-05-15

2007-05-15

Toatley, Jr., Gregory J. (Department: 2877)

Optics: measuring and testing

By alignment in lateral direction

With registration indicia

Reexamination Certificate

active

10760586

ABSTRACT:
An apparatus and method analyze overlay deviation in alignment between a first mark and a second mark that are formed on a substrate. In particular, a relationship between changes in overlay deviation values and changes in focus position of the substrate for a plurality of sets of the first and second marks that are provided on the substrate is calculated, and then an output is provided from which a user can determine whether the substrate suffers from wafer-induced-shift. Preferably, the output is a vector-map showing the relationship between changes in overlay deviation values and changes in focus position of the substrate for the plurality of sets of marks.

REFERENCES:
patent: 5766809 (1998-06-01), Bae
patent: 6563573 (2003-05-01), Morohoshi et al.
patent: 6639677 (2003-10-01), Ina et al.
patent: 6885450 (2005-04-01), Fukui
patent: 6975399 (2005-12-01), Fukui
patent: 2002/0027648 (2002-03-01), Van Der Laan et al.
patent: 2002/0060793 (2002-05-01), Fukui

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