Method and apparatus for measuring flatness and/or relative...

Optics: measuring and testing – By light interference – For dimensional measurement

Reexamination Certificate

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C356S511000

Reexamination Certificate

active

06975405

ABSTRACT:
A system and method for obtaining metrics of a semiconductor chip are provided. A first surface of a chip is positioned on a substantially flat receiving surface. A topography of the receiving surface is measured. A topography of a second surface of the chip is also measured. A relative angle between the receiving surface and the second surface of the chip are determined using the measurements of the receiving surface and the second surface of the chip.

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P.Y. Hu et al., “Optical Flat for Measuring Tape Wrap Angle”, Research Disclosure, Jul. 1989, No. 203.
A.S. Jones et al., “Static Tester for Thin Film Magnetic Heads”, IBM Technical Disclosure Bulletin, Jan. 1973, vol. 15, No. 8.
J.W. Billman et al., “Method of Checking Magnetic Head”, IBM Technical Disclosure Bulletin, Mar. 1985, vol. 27, No. 10A.

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