Optics: measuring and testing – By dispersed light spectroscopy – Utilizing a spectrometer
Patent
1993-12-22
1996-09-10
Turner, Samuel A.
Optics: measuring and testing
By dispersed light spectroscopy
Utilizing a spectrometer
356355, G01B 902
Patent
active
055554725
ABSTRACT:
The thicknesses of a first layer and of a second layer on a semiconductor wafer can be measured together by assuming that the second layer has a substantially uniform thickness. The thicknesses are measured by measuring reflectivity as a function of wavelength at a plurality of points on the wafer to provide a plurality of signatures, comparing each signature with signatures from libraries of theoretical signatures by calculating an error value associated with each signature; and determining the minimum error value. Each library is based upon a unique assumed thickness of the second layer. Thus, the thickness of the second layer is determined by identifying the library associated with the minimum error value.
REFERENCES:
patent: 5042949 (1991-08-01), Greenberg et al.
patent: 5291269 (1994-03-01), Ledger
patent: 5337150 (1994-08-01), Mumola
patent: 5365340 (1994-11-01), Ledger
Clapis Paul J.
Daniell Keith E.
Integrated Process Equipment Corp.
Turner Samuel A.
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