Method and apparatus for measuring film thickness and film thick

Details Method and apparatus for measuring film thickness and film thick Method and apparatus for measuring film thickness and film thick

1997-08-27

1999-12-21

Scherbel, David A.

Abrading

Precision device or process - or with condition responsive...

Computer controlled

451 6, 451 8, 451285, 451287, 451288, B24B 4900, B24B 500

Patent

active

060041870

ABSTRACT:
Disclosed is a method of polishing the surface of a film provided on a substrate, by use of a polishing device, while relatively moving the film surface and the polishing device. The method includes a position detecting step for detecting a predetermined position on the surface of the film, a first measurement step for measuring an absolute value of the film thickness at the predetermined position, and a second measurement step for measuring film thickness information of the film about the predetermined position, on the basis of a measured value obtained through the first measurement step. The method also includes a film thickness distribution measurement step for detecting a film thickness distribution of the film, on the basis of a data obtained through the first and second measurement steps, and a control step for controlling continuation/discontinuation of polishing, on the basis of a data obtained through the film thickness distribution measurement step.

REFERENCES:
patent: 5081796 (1992-01-01), Schultz
patent: 5157878 (1992-10-01), Hiyoshi et al.
patent: 5361547 (1994-11-01), Church et al.
patent: 5486129 (1996-01-01), Sandhu et al.
patent: 5791969 (1998-08-01), Lund

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